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Soft Silicone Gel Chips / Cx Series
High Performance In Narrow Space Enclosures.
Provide Shock, Vibration Protection and Improved Audio Fidelity.
Ideal For Handheld Applications, Fragile Components and Audio Components.
Stable Performance from -40°C up to 100°C with Adhesive.
Stable Performance from -40°C up to 200°C without Adhesive.
High Performance at 2mm+ Thickness.
Ultra soft silicone gel sheet for reducing structureborne vibrations and shock absorption. High shock absorption Ideal for broad temperature range, extreme shock and vibration environments. Adhesive one side, simply cut and attach. Low compression set. Soft enough to have enough warp for high damping and shock absorbing performance. An egg dropped from 20 meter high does not break on a sheet of this gel. This soft gel absorbs micro and low frequency vibrations not eliminated by rubbers and other damping materials. The gel also absorbs shocks and is soft enough to have enough warp for high damping and shock absorbing performance.Outstanding shock absorption characteristics by means of dispersing impact three dimensionally due to its unique molecular structure.
Low temperature dependency with stable performance from -40°C up to 100°C with adhesive. Without adhesive -40c to 200c. Performs in any weather. Excellent chemical resistance. Low compression set with performance staying the same even after repeated use. Contains nothing harmful. Environment friendly. Toxic free when burned. Compress by up to 33% for optimum performance. Various sizes available below. Can also be supplied in custom sizes and without adhesive.
We have soft gel sheet and grommets made of the same gel material. Also see our soft silicone free gel sheet.
|C1 Gel Chip
||10(w) x 10(l) x 3(t)mmmm x 10mm Thickness: 3mm
||C2 Gel Chip
||10(w) x 10(l) x 5(t)mmmm x 10mm Thickness: 5mm
||C3 Gel Chip
||15(w) x 15(l) x 3(t)mmmm x 15mm Thickness: 3mm
||C4 Gel Chip
||15(w) x 15(l) x 5(t)mmmm x 15mm Thickness: 5mm
||C5 Gel Chip
||15(w) x 15(l) x 10(t)mmmm x 15mm Thickness: 10mm
||C6 Gel Chip
||20(w) x 20(l) x 3(t)mmmm x 20mm Thickness: 3mm
||C7 Gel Chip
||20(w) x 20(l) x 5(t)mmmm x 20mm Thickness: 5mm
||C8 Gel Chip
||20(w) x 20(l) x 10(t)mmmm x 20mm Thickness: 10mm
Notes on Use
Before use, remove dust from the object.
Attach with even pressure after removing the seperation liner paper.
Apply sufficient pressure to securely attach PSA (pressure-sensitive adhesive).
Powder is applied to the surface of the gel to prevent sticking.
All specifications shown herein are typical values and are not
guaranteed. It is recommended to test in application for suitability.
Registered Company Number: 3832422 - VAT Number: GB740 7652 32
Gelmec is a division of Marcom Electronic Components (UK) Ltd.
Copyright © 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
Address:  Gelmec, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.